SMIC Shenzhen Launches Construction of First 12-in IC Production Line in South China

Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC’s Shenzhen facility. It will be the very first 12-inch fab in South China.

In order to meet the large demand for IC chips in the IoT era, SMIC Shenzhen is building the new 12-inch IC production line in an existing building. The new line will manufacture mainstream mature technology. Construction is planned to start by the end of 2016. Some second-hand equipment for the new line has already been secured. The early production is expected to begin by the end of 2017.The total designed capacity is 40,000 12-inch wafers per month; capacity ramp will be based on customer needs.

Located in Pingshan New District, Shenzhen, SMIC Shenzhen opened the first 8-inch IC production line in South China in December 2014. Its capacity is currently 30,000 wafers per month, and it will continue to expand based on market demand.

The Chairman of SMIC, Dr. Zixue Zhou, said, “Shenzhen has the largest electronic information industrial base in China, comprising hundreds of IC design, system and equipment companies. Thanks to the attention given to the IC industry from the Shenzhen Municipal Government, SMIC Shenzhen steadily operates an 8-inch production line. By launching the new 12-inch production line, SMIC will further improve our capacity, better serve our customers, and facilitate the development of Shenzhen’s IC ecosystem.”

UMC Opens New 12-inch Wafer Fab in China

United Microelectronics Corporation (UMC), a global semiconductor foundry, celebrated the grand opening of United Semi, UMC’s 12-inch joint venture wafer fab in Xiamen China. The fab, which was completed in record time, realized volume production for customer products merely 20 months after groundbreaking in March of 2015. Pilot production yields for communication ICs at the fab have already exceeded 99% on the company’s 40nm process.

Po-Wen Yen, CEO of UMC, said “Owing to the tireless teamwork of our suppliers, facilities management and engineering teams, we have realized successive, noteworthy milestones since United Semi broke ground in March, 2015. We achieved cleanroom readiness and equipment move-in within a year, and pilot run verification to mass production in only 8 months. With United Semi being able to leverage UMC’s technology expertise and over 35 years of proven manufacturing experience, we believe this new fab is the best choice for IC designers in China and worldwide who wish to manufacture their products locally in order to serve China’s vast electronics market, while also mitigating geographic risk. We are excited for the future of United Semi as today’s grand opening kicks off the next growth stage for UMC.”

United Semi is a 3-way joint venture foundry company between UMC, Xiamen Municipal People’s Government and Fujian Electronics & Information Group. Its fab, Fab 12X, is southern China’s first 300mm foundry facility. The fab will utilize UMC’s mass production 55nm and 40nm technologies, with a maximum design capacity of 50,000 wafers per month. The main advantage for choosing Xiamen as the fab location is its short distance from Taiwan, allowing seamless support from UMC’s Taiwan headquarters. Furthermore, Xiamen has a well-established infrastructure to supply ample local engineering talent and logistical support. United Semi complements UMC’s Hejian fab in Suzhou, China, which provides 8” foundry services for local and international customers.

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