CSOT and BOE Expand Facilities

In light of increasing production capacity from China-based makers, with recently announced plans by BOE to construct new 8.5G and 10.5G fabs, AU Optronics (AUO) will continue to focus on advancing technologies and increased applications to remain competitive, according to company president Paul Peng.

Recent developments by China panel makers include an announcement by BOE that it will invest CNY3 billion (US$484 million) to construct a new 8.5G fab in Fuzhou, China. The fab will be BOE's fourth 8.5G line and is expected to be completed in June 2017. Construction is expected to break ground in September of 2015.

Additionally, TCL subsidiary China Star Optoelectronics Technology's (CSOT) T2 8.5G fab in Shenkeng, China kicked off production as of April 24, 2015, which is expected to bring in CNY20 billion (US$3.22 billion) in revenues a year for the company, according to TCL chairman Li Dongsheng. The company is also planning to expand production on its T1 facilities, which are aimed at small- to medium-size panels while the T2 factory will be aimed at production of large-size, high-end TV panels. CSOT also plans to expand production at its T3 fab, aimed at production of high-end small- to medium-size panels, said Li.

Despite claims from the TCL chairman that China is expected to surpass Taiwan in panel shipments in 2015 and Korea makers two years later, Peng has asserted that China makers' expansion does not necessarily mean increased output. AUO rather is focusing on investing in diversified applications and comprehensive solutions with profit ratios to remain competitive and steady, said Peng.

Peng added that in terms of TV panels, the average-size panel shipped in the second quarter of 2015 is expected to grow another 0.8- to 1-inch while vehicle display demand remains steady.

ClassOne Enters ECD Lab Partnership with Shanghai Sinyang

Semiconductor equipment manufacturer ClassOne Technology announced that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd. Sinyang, China’s premier supplier of ECD chemicals, is purchasing ClassOne electroplating equipment and will be providing a site for demonstrating ClassOne’s tools in the Chinese marketplace. SPM International Ltd., ClassOne’s representative in China will also be providing product support and process assistance.

“This collaborative lab will be the first of its kind in the region,” said Byron Exarcos, President of ClassOne Technology. “Now, in a single location, users will be able to see the advanced performance of ClassOne’s electroplating tools and Sinyang’s electroplating chemicals and also be able to evaluate processes. It allows us to provide a complete solution — and a significant convenience — to users throughout the region.”

“We are looking forward to working with customers on the Solstice LT plating system because it is a high-performance tool and will provide an excellent real-world laboratory for ongoing enhancement of our chemicals,” said Dr. Wang Su, Vice President of Sinyang. “The new working arrangement will also enable us to provide direct input to ClassOne as they develop future generations of wet processing equipment.”

Shanghai Sinyang is purchasing ClassOne’s Solstice LT Electroplating System and Trident Spin Rinse Dryer (SRD). The Solstice LT is a two-chamber plating development tool designed for <200mm wafers. In Sinyang’s applications, one chamber will be dedicated to copper plating and the second to nickel plating, with the Trident SRD servicing both process streams. This will provide significant flexibility while substantially reducing cycle time and streamlining process development. The new equipment will be installed at the Sinyang lab facility in Shanghai, which is scheduled to begin live demonstrations in late May. The lab will be able to plate virtually all metals except gold, and it can also cross-reference with all chemicals for comparison benchmarks.

In addition to the LT development tool, ClassOne also offers the Solstice S8, an 8-chamber, fully-automated electroplating system for high-volume production needs. These tools are particularly well suited to wafer level packaging (WLP), through silicon via (TSV) and other applications that are important for MEMS, Sensors, LEDs, RF, Power and many other devices.

ClassOne Technology products have been described as “Advanced Wet Processing Tools for the Rest of Us” because they address the needs of many cost-conscious users. The company’s stated aim is to provide advanced yet affordable alternatives to the large systems from the large manufacturers. ClassOne supplies a range of innovative new wet processing tools, including its Solstice Electroplating Systems, Trident Spin Rinse Dryers and Trident Spray Solvent Tools (SSTs).

Entrepix Adds 300 mm CMP Capabilities to Phoenix Foundry

Entrepix, Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, has announced that it has expanded its foundry operations in Phoenix, Arizona by installing 300 mm chemical mechanical planarization (CMP) processing. The new offering expands on the company's existing 200mm and below foundry operations, allowing Entrepix to offer CMP R&D and volume production for all wafer sizes up to 300 mm.

To achieve this capability, Entrepix added industry leading AMAT Reflexion and Ebara F-REX 300 CMP polishing platforms in its Class 100 cleanroom. Both systems are available for various applications, including various dielectrics, metals and substrates. Additionally, the systems can be used for screening or comparing consumable sets (pads, slurries, pad conditioners and cleaning chemistries) across both platforms.

"Our foundry operations offer our customers a capability that is unique in the industry," said Tim Tobin, CEO of Entrepix. "Our CMP consumable customers can benefit from creating independent, non-biased performance data for their products."

The Entrepix foundry provides complete CMP solutions for customers at any level of development or production, allowing customers to quickly react to new technology requirements while capitalizing on increased capacity demands. This flexible manufacturing model improves financial performance by optimizing internal efficiencies and reducing time to revenue.

McIlvaine Company

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