InnoLas Semiconductor on Course for 450mm

Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80 percent. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.

Promptly at the start of the year, InnoLas Semiconductor GmbH has successfully installed a second 450mm system. As an optional bridge-tool variant the system can mark 450mm and 300mm wafers on either side. The system checks the result automatically and thus reduces the process operations significantly. According to requirements the customer can choose between vacuum handling and edge-grip handling. The latter transports the wafers especially carefully and cleanly.

The company places particular emphasis on in-house developments and products in the application of high-precision components. Together with the robust further development of proven engineering this takes care of the constant high quality standard in marking and handling processes, also for the new wafer sizes.

“The marking and handling quality will be maintained at our high level for the new wafer sizes. To achieve this we use components developed in-house whenever the requirements are of high precision. These are otherwise not available in suitable quality as required by us and our customers,” Andreas Behr, general manager of the InnoLas Semiconductor GmbH, explains the consistently high standard achieved by his wafer marking systems.

India Proposals for Two Chip Fabs

The Government has received two proposals for setting up chip fabs in India, said Kapil Sibal during CII's IT Summit. The proposals will be sent to the Cabinet in next two weeks for consideration. The investment envisaged for the two manufacturing plants is around Rs.25,000 crore; and the exact level of government support will be decided through negotiation with the chip makers. According to Sibal, the government is also considering the approval of Electronics Delivery of Services Bill.

Boston Semi Equipment Expands Semiconductor Facilities

Boston Semi Equipment has expanded its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.

The new location provides space for the company's increasing workforce, a state-of-the-art test floor for the reconfiguration of current generation semiconductor test equipment and customer test cell optimization, a temperature-controlled environment for front end fab tool inspections, and increased storage space for the company's inventory of ready-to-ship semiconductor manufacturing equipment.

Boston Semi Equipment is a semiconductor equipment company that provides fab tools, front and back end test equipment, and service solutions for semiconductor manufacturers and OSATs worldwide. The company has operations in Burlington, Mass.; Tempe, Ariz.; the Philippines; Japan; Taiwan; and Singapore.

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